Depaneling stress maintained at approximately 200 µε (microstrain).
CCD visual positioning with Mark point calibration system.
Simple operation with fast programming.
Cutting surface is smooth, flat, and bright.
Safety light curtain and two-hand button device.
Ideal for cutting V-groove PCBA, effectively resolving component clearance challenges during cutting.
| Parameter | Specification |
|---|---|
| Model | XJH-500C |
| Valid Cutting Size | 280mm×280mm |
| Cutting Function | Linear |
| Process Table | Single Table |
| Repeat Precision | ±0.01mm |
| Cutting Precision | ±0.05mm |
| Maximum Moving Stroke | XY:1000mm/sec Z:600mm/sec |
| Max Moving Trip | X:500mm/Y:700mm/Z:100mm |
| Spindle Speed | Max: 8000 RPM Adjustable |
| Tool Change Method | Manual Tool Change |
| Safety Protection | Light Curtain / Safety Door Protection |
| Cutting Speed | 1-100mm/s Adjustable |
| Operating System | Windows |
| Program Teaching Method | CCD Image Intuitive Teaching Input |
| Program Backup | USB3.0 |
| Control Mode | Precision Multi Axis Control System |
| XYZ axis Driving Method | AC Servo Motor Drive |
| Size Of Saw Blade | Outer diameter 80 × Inner hole 35 × Number of teeth 60 × Thickness 0.8 × Blade edge 0.3mm |
| Workbench Mode | Rotate |
| Static Elimination | Ion Generator |
| Voltage/Power Requirement | Depaneling Machine: AC 220V 50HZVacuum Cleaner: AC 380V 50HZ |
| Pneumatic Pressure Requirement | 0.6MPa, 75L/min |
| Dimensions(W×D×H) | 900×1375×1575 mm |
| Weight | 510KG |